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Microporous Hard Board

microporous-hard-board-tuya
microporous-hard-board-tuya

Microporous Board is an efficient insulation product based on advanced microporous insulation technology. At low temperature, it has a lower thermal conductivity than still air. The thermal conductivity increases very little with the increase of temperature.

Parameter

MICROPOROUS BOARD

Microporous Board is an efficient insulation product based on advanced microporous insulation technology. At low temperature, it has a lower thermal conductivity than still air. The thermal conductivity increases very little with the increase of temperature. At high temperature, its insulation effect is 3-4 times higher than traditional insulation materials. Microporous Hard Board has high compressive strength, covered with aluminum foil or glass fiber cloth. It is an excellent choice for the lightweight and energy-saving application of kiln.


Features

Excellent thermal shock resistance

Excellent thermal stability

Low thermal conductivity

Low heat storage


Typical Applications

Back-up insulation in high-temperature furnaces

Appliances insulation

Fire protection equipment

Electronic devices


Parameter2

DescriptionMICROPOROUS 60H
BOARD
MICROPOROUS 90H
BOARD
MICROPOROUS 105H
BOARD
Recommended Temperature of Use (℃ )6009001050
Density (kg/m³)300/320280/300320
Modules of Rupture (MPa)≥0.15≥0.15≥0.15
Compressive Strength (MPa, 10% relative deformation)≥0.3≥0.3≥0.3
Permanent Linear Shrinkage (%)600℃ x 24h ≤2.0900℃ x 24h ≤2.01050℃ x 24h ≤2.5
Thermal Conductivity (W/m·K)
100℃0.0220.0200.022
200℃0.0240.0230.024
300℃0.0280.0260.031
400℃0.0290.0270.036
500℃-0.0330.040
600℃--0.048
Covering MaterialAluminum Foil / PE Foil / Glass Fiber Cloth
Standard Size (mm)600 x 400 x (10-50)
1000 x 500 x (10-50)

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